半导体材料制程
GNX300B背面减薄机Back Grinder

该设备用于晶圆背面减薄工艺。


 

Model GNX300B grinder is a fully automatic continuous downfeed grinding machine.

Wafers are handled through the machine by a robot,and load/unload arms.

Two different stations are used for wafer cleaning after the final grind station.

Chuck speed,grinding wheel,and grind spindle downfeed rate speeds can be used to manipulate grinder throughput,surface finish,and wheel life.A two-point in-process gauge measuring system controls wafer thickness under grind spindles 1 and 2.

A three-point grind spindle angle adjustment mechanism is utilized for easily maintaing wafer profile(ttv);with the option for a motorized adjustment.The main motors are maintenancefree AC servomotors.I/O data,grinding conditions,

error messages are clearly visible on the GUI touch screen anddownloadable through the computer.All computer logs are automatically saved for 30 days.SECS/GEM communication software is also available.

In-line polish or etch system may be directly connected to the  GNX300B.

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