In August 2014, our company obtained the first-level sales agency right of Japan Okamoto Machine Tool Co., Ltd. (hereinafter referred to as "OKAMOTO Okamoto"), a famous brand of wafer back thinning equipment, and further improved our chip packaging front-end project (Thinning + dicing) and TSV/CSP/MEMS whole line proposal configuration. 
OKAMOTO Okamoto mainly specializes in the production of grinder products. The main products are surface grinders, internal and external cylindrical grinders, universal grinders, gantry type (moving beam/fixed beam type) grinders, gear grinders, ultra-precision optical curve grinders, and optical grinders. OKAMOTO Okamoto is the world's largest grinding machine manufacturer, and its wafer backside thinning machines are used in world-class semiconductor manufacturers. In the front-end engineering of chip packaging, we can provide thinning + dicing process equipment and material solutions: Nitto Denko (NITTO) automatic film + tearing machine, OKAMOTO Okamoto automatic wafer back thinning machine, Israel ADT automatic dicing machine, APD carbon dioxide foaming machine (ultra-pure water anti-static device), UV irradiation machine, film expanding machine, NITTO BG/Dicing TAPE, etc. In terms of TSV/CSP/IGBT advanced packaging, we can provide ULVAC (Aifa Branch) etching/deadhesive/PECVD/sputtering system + OKAMOTO automatic thinning machine overall solution.
Yoshinaga is the only best partner who can provide you with a complete line of semiconductor packaging processing solutions!
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