October 2014 1. The maintenance project of SPEEDFAM 20B of Grinding Equipment for GRINM new Materials Institute was successfully completed. 2. Visit Chinese customers with the head of OKAMOTO (Okamoto) China to provide customers with solutions for the back thinning process. November 2014 1. Qingdao Hisense's rapid thermal annealing furnace was shipped smoothly. 2. Reached a cooperation intention with Huajin Semiconductor Packaging Pilot Technology R&D Center Co., Ltd. December 2014 1. The installation and commissioning of the Nikon silicon wafer transfer testing platform of Nikon has been successfully completed. 2. The magnetron sputtering station project of Hebei Semiconductor Research Institute won the bid. 3. Successful cooperation on the back thinning equipment project of Mattel Semiconductor. 4. Cathay Pacific Semiconductor's 12-inch SPEEDFAM precision polishing equipment maintenance was successfully completed.
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