Huajin Semiconductor Packaging Pilot Technology R&D Center Co., Ltd. was formally registered and established in Wuxi New District in September 2012. The full English name of the company is: National Center for Advanced Packaging Co., Ltd. (NCAP China). The company is composed of the Institute of Microelectronics of the Chinese Academy of Sciences and the leading companies in the integrated circuit packaging and testing industry, Changdian Technology, Tongfu Microelectronics, Huatian Technology, Shennan Circuits, Suzhou Jingfang, Anjieli (Suzhou), Zhongke IOT, Xingsen Express Nine units jointly invested and established.
As a national-level packaging and testing/system integration pilot technology research and development center, the company's research areas include 2.5D/3D through silicon via (TSV) interconnection and key integration technologies, wafer-level high-density packaging technology, Sip product applications, and packaging technology-related Verification, improvement and research and development of materials and equipment, advanced packaging design simulation platform, packaging substrate line, test laboratory and reliability and failure analysis platform.
Huajin adheres to the vision of a world-class packaging and system integration pilot technology research and development and industrialization center. It is market demand-oriented, paid service as the principle, and technology achievements are transferred to create revenue, serve the industry, and join hands with Jiyong Commercial. Promote the development of China's semiconductor industry.
Company website: http://www.ncap-cn.com (Edit: Vienna.li)
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