Shanghai prosrun Technology Co., Ltd.

Add : 7C Huamin Hanzun,
       NO.726 Yan'an West
       Road, Changning
       District, Shanghai.

Tex : (86)21-5821-0030

Fax : (86)21-5860-0110

E-mail : info@yoshi.co.jp


Semiconductor Materials
Wafer chamfering machine

This device is mainly a machine for chamfering the outer periphery of the silicon wafer. Chamfer the forming of OF according to requirements. This device consists of a body with two independent processing platforms and a transport device using a horizontal multi-joint robot. Work position is determined, and the position is detected and corrected by image processing. Measure the thickness of the wafer on the processing platform (measure 1 piece), and classify it according to the thickness (6 types), and then discharge them to 6 stacks. The finished product is recycled into the stack in a dry state by spin drying.




Features:

●One machine has two machining axes for simultaneous processing, saving space and high productivity (twice the single machine)

●Outer shape processing, OF edge, notch processing, can be handled with one unit

●Can process special shapes

●It is possible to process different types of workpieces on the two workbenches A and B at the same time.

●Processing range φ200mm and φ300mm (please consult for other sizes)



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